Effects of hot dipping temperature on microstructure and mechanical properties of Pb40Sn60 alloy coating on copper wires
Xiaofei Yao, Sifan Xia, Yukun Lv, Wei Yang, Jian Chen
Topics & Concepts
Materials scienceMicrostructureEutectic systemAlloyLamellar structureMetallurgyCopperScanning electron microscopeCoatingElectron backscatter diffractionUltimate tensile strengthComposite materialElectronic Packaging and Soldering TechnologiesAdvanced Welding Techniques AnalysisAluminum Alloys Composites Properties