Influence of thermal shock behavior on microstructure and interface bonding strength of WC/W coating
Xueying Han, Yang Sun, Xinli Liu, Zhuangzhi Wu, Lei Zhang, Dezhi Wang
Topics & Concepts
Materials scienceThermal shockCoatingComposite materialMicrostructureTungsten carbideSubstrate (aquarium)Bond strengthTungstenShock (circulatory)Layer (electronics)MetallurgyAdhesiveGeologyMedicineInternal medicineOceanographyAdvanced materials and compositesMetal and Thin Film MechanicsDiamond and Carbon-based Materials Research