A nanostructured Ag/Cu multilayered composite exhibiting high hardness and high electrical conductivity prepared by a novel multicomponent accumulative roll bonding
Hao Dong, Yuzeng Chen, Yongchun Guo, G.B. Shan, Guo‐Yu Yang, Linke Huang, Feng Liu, Qian Li
Topics & Concepts
Materials scienceAccumulative roll bondingNanoindentationComposite numberMicrostructureComposite materialTransmission electron microscopyElectrical resistivity and conductivityElectron backscatter diffractionConductivityCopperScanning electron microscopeDiffractionGrain boundaryGrain sizeMetallurgyNanotechnologyOpticsPhysicsPhysical chemistryChemistryElectrical engineeringEngineeringMicrostructure and mechanical propertiesAluminum Alloys Composites PropertiesAdvanced Welding Techniques Analysis