Microstructure and mechanical behavior of SnBi-xAg and SnBi-xAg@P-Cu solder joints during isothermal aging
Yang Liu, Boqiao Ren, Yuxiong Xue, Min Zhou, Rongxing Cao, Penghui Chen, Xianghua Zeng
Topics & Concepts
SolderingMicrostructureMaterials scienceIsothermal processShear strength (soil)MetallurgyComposite materialJoint (building)PorosityShear (geology)Solder pasteLayer (electronics)Structural engineeringThermodynamicsPhysicsEngineeringSoil waterEnvironmental scienceSoil scienceElectronic Packaging and Soldering Technologies3D IC and TSV technologiesAluminum Alloys Composites Properties