Three-dimensional skeleton assembled by carbon nanotubes/boron nitride as filler in epoxy for thermal management materials with high thermal conductivity and electrical insulation
Yang Wang, Yifan Wang, Yun Li, Yun Li, Can Gao, Xiaojuan Tian, Ni Wu, Zishuo Geng, Sai Che, Fan Yang, Yongfeng Li, Yongfeng Li
Topics & Concepts
Materials scienceBoron nitrideEpoxyComposite materialThermal conductivityCarbon nanotubeComposite numberCoatingThermal insulationLayer (electronics)Thermal properties of materialsThermal Radiation and Cooling TechnologiesAdvanced Thermoelectric Materials and Devices