Electroplating of Cu/Sn bumps with ultrafine pitch and high uniformity for micro-LED interconnection

Canlin Luo, Chang Lin, Jinyu Ye, Huangjie Zeng, Xiongtu Zhou, Chaoxing Wu, Yongai Zhang, Jie Sun, Tailiang Guo, Qun Yan

2024Journal of Materials Science Materials in Electronics12 citationsDOI

Topics & Concepts

InterconnectionElectroplatingMaterials scienceMetallurgyOptoelectronicsEngineering physicsNanotechnologyComputer scienceEngineeringTelecommunicationsLayer (electronics)Electronic Packaging and Soldering TechnologiesElectrodeposition and Electroless Coatings3D IC and TSV technologies