A High Coupling Coefficient and Symmetric Transformer Based on TSV
Yue Deng, Fengjuan Wang, Xiangkun Yin, Yuan Yang, Ningmei Yu, Yan Li
Abstract
Transformers are the key passive devices in many radio frequency integrated circuit (RF IC) applications. In this article, a kind of ultrahigh coupling coefficient and symmetric transformer based on through-silicon via (TSV) is proposed. HFSS software is used to model and simulate the transformers with turn ratios of 1:1, 1:2, and 1:3, and the three structures are manufactured and measured. The measurement results show that the coupling coefficients of the three are 0.956, 0.971, and 0.954, and the areas are 0.007, 0.012, and 0.015 mm2. Compared with other literatures, it has the characteristics of high coupling and miniaturization.
Topics & Concepts
Coupling coefficient of resonatorsMaterials scienceTransformerElectronic engineeringCoupling (piping)Computer scienceOptoelectronicsElectrical engineeringEngineeringVoltageComposite materialResonatorPhotonic and Optical DevicesSemiconductor Lasers and Optical Devices3D IC and TSV technologies