Enhanced adhesion strength of silver paste on AlN ceramic substrate via sintered nano-CuO
Yanqing Zou, Renli Fu, Xuhai Liu, Houbao Liu, He Wang
Topics & Concepts
Materials scienceSubstrate (aquarium)CeramicLayer (electronics)Scanning electron microscopeComposite materialAdhesionSinteringOceanographyGeologyElectronic Packaging and Soldering Technologies3D IC and TSV technologiesCopper Interconnects and Reliability