Stress/strain characterization in electronic packaging by micro-Raman spectroscopy: A review
Lulu Ma, Wei Qiu, Xuejun Fan
Topics & Concepts
Microscale chemistryResidual stressMaterials scienceRaman spectroscopyStress (linguistics)Electronic packagingCharacterization (materials science)SemiconductorSiliconElectronic engineeringOptoelectronicsComposite materialNanotechnologyOpticsEngineeringPhysicsPhilosophyLinguisticsMathematics educationMathematicsIntegrated Circuits and Semiconductor Failure AnalysisThin-Film Transistor Technologies3D IC and TSV technologies