Design of a GaN-Based Flip Chip Light Emitting Diode (FC-LED) with au Bumps & Thermal Analysis with Different Sizes and Adhesive Materials for Performance Considerations

Manvinder Sharma, Digvijay Pandey, Dishant Khosla, Sumeet Goyal, Binay Kumar Pandey, Anuj Gupta

2021Silicon71 citationsDOI

Topics & Concepts

Materials scienceFlip chipOptoelectronicsLight-emitting diodeAdhesiveDiodeThermalChipComposite materialElectrical engineeringPhysicsEngineeringLayer (electronics)MeteorologyGaN-based semiconductor devices and materials3D IC and TSV technologiesSemiconductor Lasers and Optical Devices

Design of a GaN-Based Flip Chip Light Emitting Diode (FC-LED) with au Bumps &amp; Thermal Analysis with Different Sizes and Adhesive Materials for Performance Considerations

Topics & Concepts

Design of a GaN-Based Flip Chip Light Emitting Diode (FC-LED) with au Bumps & Thermal Analysis with Different Sizes and Adhesive Materials for Performance Considerations