Low-temperature copper sinter-joining technology for power electronics packaging: A review
Yujian Wang, Dou Xu, Haidong Yan, Cai‐Fu Li, Chuantong Chen, Wanli Li, Wanli Li
Topics & Concepts
ElectronicsCopperElectronic packagingMaterials sciencePower electronicsMetallurgyEngineeringComposite materialElectrical engineeringVoltageElectronic Packaging and Soldering Technologies3D IC and TSV technologiesAdvanced Welding Techniques Analysis