New insights into fracture of Si in Cu-filled through silicon via during and after thermal annealing
Dipali Sonawane, Praveen Kumar
Topics & Concepts
Materials scienceAnnealing (glass)MicroelectronicsWaferSiliconNucleationComposite materialCopperThermal expansionFabricationMetallurgyOptoelectronicsChemistryAlternative medicineOrganic chemistryPathologyMedicine3D IC and TSV technologiesElectronic Packaging and Soldering TechnologiesAdvanced Surface Polishing Techniques