Ultra-low damage processing of silicon wafer with an innovative and optimized nonwoven grind-polishing wheel
Shang Gao, Jinxing Huang, Yu Zhang, Xiaoguang Guo, Renke Kang
Topics & Concepts
PolishingGrindMaterials scienceAbrasiveGrindingWaferSurface roughnessMachiningGrinding wheelChemical-mechanical planarizationComposite materialSurface finishDiamondSiliconAbrasive machiningSurface integrityMetallurgyOptoelectronicsAdvanced Surface Polishing TechniquesDiamond and Carbon-based Materials ResearchAdvanced machining processes and optimization