Effect of Joint Size on Creep Behavior of Sn-Ag-Cu Solder-Cu Joints
Anwesha Kanjilal, P. Ramesh Narayanan, M. Agilan, Praveen Kumar
Topics & Concepts
CreepMaterials scienceSolderingJoint (building)MicrostructureDislocationComposite materialStress (linguistics)ClimbScanning electron microscopeMetallurgyUltimate tensile strengthStructural engineeringThermodynamicsPhysicsPhilosophyLinguisticsEngineeringElectronic Packaging and Soldering TechnologiesAluminum Alloys Composites PropertiesAdvanced Welding Techniques Analysis