Quasi-in-situ observation of the grain growth and grain boundary movement in sintered Cu nanoparticle interconnects
Yang Zuo, Cong Zhao, Ana Robador, M Wickham, S.H. Mannan
Topics & Concepts
Materials scienceSinteringGrain growthPorosityGrain boundaryGrain boundary diffusion coefficientNanoparticleComposite materialGrain sizeDislocationMetallurgyNanotechnologyMicrostructureElectronic Packaging and Soldering TechnologiesAluminum Alloys Composites PropertiesMicrostructure and mechanical properties