In-air sintering of copper nanoparticle paste with pressure-assistance for die attachment in high power electronics
Boyao Zhang, Andrei Damian, J.L.J. Zijl, Henk van Zeijl, Yu Zhang, Jiajie Fan, Guoqi Zhang
Topics & Concepts
SinteringMaterials scienceMicrostructureShear strength (soil)MetallurgyNanoparticleCopperComposite materialNanotechnologyEnvironmental scienceSoil waterSoil scienceElectronic Packaging and Soldering TechnologiesAluminum Alloys Composites Properties3D IC and TSV technologies