Effect of co on the morphology and mechanical properties of the Sn-3.0Ag-0.5Cu/Sn-58Bi composite solder joints on ENEPIG surface
Shuai Zhang, Shuai Zhang, Xinyi Jing, Shang Zhang, Shang Zhang, Jieshi Chen, Kyung‐Wook Paik, Peng He, Shuye Zhang, Shuye Zhang
Topics & Concepts
SolderingMaterials scienceMicrostructureMicroelectronicsJoint (building)Composite numberMetallurgyComposite materialOptoelectronicsStructural engineeringEngineeringElectronic Packaging and Soldering Technologies3D IC and TSV technologiesMetallurgical and Alloy Processes