MXene Nanofluid-Driven Interfacial Synergy for Next-Generation Anisotropic Conductive Films
Guoxiang Zhang, Peipei Li, Wei Zhao, Yongkun Wang, Lu Zhang, Jing Shi, Chen Su, Wei Du, Zhimin Li, Xiaowei Liu
Abstract
Anisotropic conductive films (ACF) are pivotal in enabling high-precision interconnects for next-generation flexible electronics, yet the long-standing trade-off between mechanical robustness and electrical/thermal performance severely limits their application in high-end devices. Here, we present a paradigm-shifting strategy that leverages covalently bonded core-shell structured MXene nanofluid (NF) to achieve multifunctional enhancement in epoxy-based ACF. The innovative MXene NF creates multiscale interfacial synergy through covalent siloxane bridging and physical crack deflection mechanisms, delivering remarkable mechanical improvements: 35% increase in bonding strength (25.22 MPa), enhanced tensile strength (10.87 MPa), and unprecedented elongation at break (199.12%) at 10% loading. Crucially, the MXene NF/ACF preserves directional electrical anisotropy with Z -axis contact resistance of 7.68–7.77 Ω and XY-plane insulation resistance exceeding 10 6 Ω, alongside superior thermal stability ( T d, 5% > 200 °C). Additionally, a proof-of-concept PCB-FPC-FPC (Printed Circuit Board to Flexible Printed Circuit to Flexible Printed Circuit) multilayer interconnection board validates practical applicability. This work establishes MXene NF as a transformative toughening agent, pioneering a universal platform to design mechanically resilient, flexible electronic packaging materials critical for foldable displays and wearable microsensors.