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Incorporating negative thermal expansion Cu2V2O7 into epoxy to achieve low thermal expansion and high thermal conductivity

Jinguo Li, Feiyu Qin, Yuguang Lv, Xin Yang, Tianhang Wu, Xiao-Ling Wang, Wenhui Xu, Nianjie Liu, Jun Wang, Lei Hu, Jun Sun, Xiangdong Ding

2025Journal of Alloys and Compounds6 citationsDOI

Topics & Concepts

Thermal expansionThermal conductivityNegative thermal expansionEpoxyMaterials scienceComposite materialThermalThermomechanical analysisThermodynamicsPhysicsThermal Expansion and Ionic ConductivityAdvanced Battery Materials and TechnologiesFerroelectric and Piezoelectric Materials
Incorporating negative thermal expansion Cu2V2O7 into epoxy to achieve low thermal expansion and high thermal conductivity | Litcius