Experimental study of an integrated aluminum flat plate heat pipe for lightweight thermal management in electronic devices
Jingjing Bai, Yiming Li, Yincai Zhao, Fangqiong Luo, Tong Sun, Yifu Liang, Tang Yong, Shiwei Zhang
Topics & Concepts
Thermal management of electronic devices and systemsMaterials scienceAluminiumThermalHeat pipeMechanical engineeringComposite materialEngineering drawingEngineeringHeat transferMechanicsPhysicsThermodynamicsHeat Transfer and Boiling StudiesHeat Transfer and OptimizationAdvanced Sensor Technologies Research