Bonding of power device to ceramic substrate using Sn-coated Cu micro paste for high-temperature applications
Jeong-Won Yoon, Soyoung Bae, Byung‐Suk Lee, Seung‐Boo Jung
Topics & Concepts
Materials scienceCeramicIntermetallicSinteringShear strength (soil)Substrate (aquarium)Solder pasteComposite materialBonding strengthPlating (geology)ElectronicsElectronic packagingMetallurgySolderingAlloySoil waterOceanographyChemistryEnvironmental sciencePhysical chemistrySoil scienceGeophysicsGeologyElectronic Packaging and Soldering Technologies3D IC and TSV technologiesAdvanced Welding Techniques Analysis