From early microstructural evolution to intergranular crack propagation in SAC solders under thermomechanical fatigue
Emna Ben Romdhane, P. Roumanille, A. Guédon-Gracia, S. Pin, Phuc Dinh Nguyen, H. Frémont
Topics & Concepts
SolderingIntergranular corrosionMaterials scienceMicrostructureTemperature cyclingElectron backscatter diffractionRecrystallization (geology)MetallurgyJoint (building)ThermalComposite materialStructural engineeringGeologyEngineeringPhysicsPaleontologyMeteorologyElectronic Packaging and Soldering TechnologiesAluminum Alloy Microstructure PropertiesAluminum Alloys Composites Properties