Effect of aging time and loading rate on fracture behavior of Cu/Sn-0.7Cu solder joints
Ved Prakash Sharma, Naresh V. Datla
Topics & Concepts
Materials scienceSolderingIntermetallicJoint (building)BrittlenessComposite materialFracture (geology)FractographyScanning electron microscopeMetallurgyStructural engineeringAlloyEngineeringElectronic Packaging and Soldering TechnologiesAluminum Alloys Composites PropertiesAdvanced Welding Techniques Analysis