Reflow Soldering-Resistant Solid-State 3D Micro-Supercapacitors Based on Ionogel Electrolyte for Powering the Internet of Things
Bouchra Asbani, Botayna Bounor, Kévin Robert, Camille Douard, Laurence Athouël, Christophe Lethien, Jean Le Bideau, Thierry Brousse
Abstract
The fabrication of all solid-state 3D micro-supercapacitor is challenging for powering connected and miniaturized emerging electronics devices in the frame of the future Internet of Things paradigm. Here we highlight the design of a specific solid electrolyte based on ethylmethylimidazolium bis(trifluoromethanesulfonate)imide confined within polyvinylidenefluoride which enables to meet the requirements of safety, easy packaging, and leakage free 3D micro-supercapacitors. This ionogel-based microdevice (2 mm × 2 mm footprint area) exhibits good cycling stability over 30 000 cycles with an areal energy density of 4.4 μ Wh.cm −2 and a power density of 3.8 mW.cm −2 . It can also sustain the high temperature reflow soldering process (∼250 °C–5 min) without damage, which is performed to directly bond surface mounted miniaturized devices onto printed circuit boards. This strategy not only provides a reference for the design of high-performance 3D interdigitated micro-supercapacitors, but also paves the way to their further implementation in miniaturized electronic chips for Internet of Things applications.