Multimaterial Additive Manufacturing of LTCC Matrix and Silver Conductors for 3D Ceramic Electronics
Peiren Wang, Ji Li, Guoqi Wang, He Liu, Yanqing Yu, Bo Xu
Abstract
Abstract Ceramic electronics have the advantages of large ampacity, high thermal conductivity, and excellent dielectric properties which are widely used in power electronics, optoelectronics, automotive industry, and aerospace technology. This work proposes a multimaterial dispensing additive manufacturing technology for customizing the 3D low‐temperature‐cofired ceramic (LTCC) circuitry. Customized LTCC aqueous slurry is first developed and then 3D printed together with commercial silver paste to build the green body. Then, the green body is debinded and sintered with a three‐stage process at 200, 500, and 850 °C, respectively. The shrinkage rate in 3D is around 17% which is comparable with commercial LTCCs. The surface quality of the sintered ceramic is improved obviously compared with that of the green body due to the glazing effect of the glass phase. For the silver conductor, the resistivity and the temperature coefficient of resistance are 2.34 ± 0.04 µΩ cm and 3.56 × 10 −3 °C −1 , respectively. A serial of demonstrators including 2D, 3D light‐emitting diode ceramic circuit boards and a ceramic heater/thermometer is developed to prove the potential and feasibility of the proposed technology.