Free fall drop impact analysis of board level electronic packages
N. Muthuram, S. Saravanan
Topics & Concepts
Drop testDrop impactSolderingFinite element methodDrop (telecommunication)Structural engineeringEngineeringCrackingElectronic packagingMechanical engineeringMaterials scienceElectronic engineeringComposite materialSplashElectronic Packaging and Soldering TechnologiesMaterial Properties and ProcessingElectrostatic Discharge in Electronics