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Emerging roles of hydrogels, organogels, and their hybrids in soft bioelectronics and bioplatforms

Min Young Lee, Eun Seo Lee, Ko nayoung, Hye Jin Kim, Dae‐Hyeong Kim, Gi Doo Cha, Ja Hoon Koo

2025npj Biosensing21 citationsDOIOpen Access PDF

Abstract

Gels are semi-solid materials characterized by a high fluid content embedded within three-dimensional polymer networks. These network structures confer a wide range of physical and chemical functionalities that can be finely tuned by altering the composition and structural properties of the gel, allowing for customized designs tailored to specific biomedical applications 1 , 2 , 3 . In this regard, gel-based bioelectronics and bio-platforms have recently emerged as a promising class of technologies that bridge the gap between biological systems and electronic devices. These platforms are playing increasingly important roles in various biomedical domains, including drug-delivery 4 , 5 , bio-sensing 6 , 7 , and soft robotics 8 , 9 (Fig. 1 ). Conventional bio-electronic systems, typically constructed from rigid materials such as silicon and metals, suffer from poor mechanical compatibility with soft biological tissues. This mismatch often leads to adverse effects such as inflammation, reduced signal transmission efficiency, and challenges in achieving stable long-term bio-integration. In contrast, gel-based systems offer intrinsic softness and flexibility, enabling superior physical and chemical compatibility with biological environments. These properties not only enhance device-tissue integration but also open new possibilities for the development of next-generation biomedical devices with improved functionality and biocompatibility.

Topics & Concepts

BioelectronicsBiocompatibilityNanotechnologySelf-healing hydrogelsMaterials scienceSoft materialsThermal stabilityPolymerIdeal (ethics)ChemistryBiocompatible materialBiological materialsHybrid materialHybrid systemPolymer scienceAdvanced Sensor and Energy Harvesting MaterialsConducting polymers and applicationsAdvanced Materials and Mechanics