Numerical modeling and analysis of thermal and mechanical behavior for ground wire-clamp system under short-circuit current
Gang Liu, Wencheng Zheng, Deming Guo, Ruidong Peng, Xuan Lin, Meishan Zhong
Topics & Concepts
Current (fluid)ClampElectrical engineeringThermalShort circuitMechanicsEngineeringMaterials scienceMechanical engineeringPhysicsVoltageClampingThermodynamicsMechanical stress and fatigue analysisElectrical Contact Performance and AnalysisAdhesion, Friction, and Surface Interactions