Low-temperature hybrid bonding with high electromigration resistance scheme for application on heterogeneous integration
Zhong-Jie Hong, Demin Liu, Hanwen Hu, Chien-Kang Hsiung, Chih-I Cho, Chih-Han Chen, Jui-Han Liu, Ming-Wei Weng, Mu-Ping Hsu, Ying-Chan Hung, Kuan‐Neng Chen
Topics & Concepts
PassivationElectromigrationMaterials scienceCluster (spacecraft)Reliability (semiconductor)Layer (electronics)OptoelectronicsElectronic engineeringNanotechnologyComposite materialComputer scienceEngineeringPhysicsProgramming languagePower (physics)Quantum mechanics3D IC and TSV technologiesElectronic Packaging and Soldering TechnologiesCopper Interconnects and Reliability