Cu–Cu low-temperature diffusion bonding by spark plasma sintering: Void closure mechanism and mechanical properties
Wendi Li, Yuxin Liang, Yang Bai, Tiesong Lin, Bangsheng Li, Jicai Feng
Topics & Concepts
Spark plasma sinteringMaterials scienceVoid (composites)Diffusion bondingSinteringPlasmaDiffusionMechanism (biology)Composite materialMetallurgyThermodynamicsPhilosophyQuantum mechanicsPhysicsEpistemologyAluminum Alloys Composites PropertiesAdvanced materials and compositesMicrostructure and mechanical properties