Periodic reverse electrodeposition of (1 1 1)-oriented nanotwinned Cu in small damascene SiO2 vias
Shih‐Chi Yang, Dinh-Phuc Tran, Jia-Juen Ong, Wei-Lan Chiu, Hsiang-Hung Chang, Chih Chen
Topics & Concepts
Copper interconnectElectroplatingDuty cycleOptoelectronicsElectrolyteElectrodeChemistryComposite materialCopperMaterials scienceMetallurgyVoltageElectrical engineeringLayer (electronics)EngineeringPhysical chemistryElectrodeposition and Electroless CoatingsElectronic Packaging and Soldering TechnologiesCopper Interconnects and Reliability