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Image-processing-based model for the characterization of surface roughness and subsurface damage of silicon wafer in diamond wire sawing

Shenxin Yin, Huapan Xiao, Heng Wu, Chunjin Wang, Chi Fai Cheung

2022Precision Engineering30 citationsDOI

Topics & Concepts

WaferMaterials scienceDiamondCharacterization (materials science)Surface roughnessSiliconSurface finishOptoelectronicsComposite materialNanotechnologyAdvanced Surface Polishing TechniquesAdvanced machining processes and optimizationSurface Roughness and Optical Measurements
Image-processing-based model for the characterization of surface roughness and subsurface damage of silicon wafer in diamond wire sawing | Litcius