Oblique microchannel merged with circle micro pin-fin as a novel hybrid heat sink for cooling of electronic devices
Yousef Alihosseini, Yaser Oghabneshin, Amir Rezazad Bari, Sahel Moslemi, Mohammad Zabetian Targhi, Wei Guo, Amirarsalan Mashhadian
Abstract
Recently, the advantages of microchannel and micro pin-fin heat sinks for cooling have become clear. This study delves into the effects of hybrid designs on electronic chip cooling by combining microchannel and pin-fin patterns. The research contrasts the performance of a straight microchannel heat sink (Case Ⅰ), circular pin-fin (Case Ⅱ), straight-circular pin-fin-straight (Case Ⅲ), and oblique grooved straight-circular pin-fin-oblique grooved straight (Case Ⅳ). Results show that Case Ⅳ's Nu number reaches 61 at Re = 1250, surpassing Case Ⅰ, Case Ⅱ, and Case Ⅲ by 517 %, 32 %, and 235 %, respectively. Case Ⅳ also has the highest pressure drop. The study calculates each Case's performance evaluation index (ƞ), highlighting the balance between enhanced Nu numbers and pressure drops. Case Ⅳ's ƞ is notably higher than Case Ⅱ and Case Ⅲ. To achieve a more uniform thermal distribution across the entire heat sink, the orientation of the oblique grooves is modified in Case Ⅳ, resulting in a new design labeled Case Ⅴ. While Cases Ⅳ and Ⅴ have similar Nusselt numbers, Case Ⅴ's design ensures consistent temperature distribution, reducing hotspot risks on the chip.