Cu-Cu Wiring: The Novel Structure of Cu-Cu Hybrid Bonding
Yoshihisa Kagawa, Takumi Kamibayashi, Nobutoshi Fujii, Shunsuke Furuse, Taichi Yamada, Tomoyuki Hirano, Hayato Iwamoto
Abstract
We have developed the novel structure of Cu-Cu hybrid bonding called “Cu-Cu wiring”. The Cu-Cu wirings have been formed through hybrid bonding of Cu lines. The new CMP process has been developed to form the various wiring patters at bonding interface. The investigation of electrical properties and reliabilities has showed the satisfactory performance of Cu-Cu wirings for the next-generation 3D stacked devices. The mechanisms that wafer bonding misalignment has degraded the electrical properties of Cu-Cu wirings have been also investigated.
Topics & Concepts
Materials scienceWaferCopperAnodic bondingWafer bondingBonding strengthOptoelectronicsMetallurgyComposite material3D IC and TSV technologiesElectronic Packaging and Soldering TechnologiesCopper Interconnects and Reliability