Revealing hot deformation behavior of inconel X-750 superalloy: A novel hot processing map coupled with grain boundary engineering
Jieke Zhang, Yu Cao, Yuhao Gong, Jun Xiao, Yulong Zhu, Rui Luo, Qubo He, Qing Liu
Abstract
In this work, a series of isothermal hot compression tests were performed at the temperature of 900–1150 °C with the strain rate ranging from 0.01 to 10s−1 in Inconel X-750 alloy (referred as Alloy X-750). Based on the flow stress data, the back-propagation artificial neural network model was utilized to accurately predict the flow stress at elevated temperatures. Subsequently, by constructing a modified hot processing map coupled with the variation of Σ3n (n = 1, 2, and 3) twin boundaries fraction, the optimal processing parameters were determined to be in the range of 1100–1150 °C and 1-10s−1 for Alloy X-750. Moreover, the possibility of grain boundary engineering via hot deformation were also evaluated by using some critical quantification descriptors of twin related domains (TRDs), such as the number of grains in the TRDs, the lengths of the longest chain, and the average TRDs size. All the results can further verify the validity of modified hot processing map. Finally, the high-temperature flow behavior combined with the relevant microstructure characterization showed that discontinuous dynamic recrystallization is considered as the predominant softening mechanism, while the continuous dynamic recrystallization and particle-stimulated nucleation also additionally contribute to the recrystallization nucleation during the hot deformation of Alloy X-750.