Sintering mechanism of size-controllable Cu-Ag core–shell nanoparticles for flexible conductive film with high conductivity, antioxidation, and electrochemical migration resistance
Wenwu Zhang, Yan-Hong Zhou, Yiping Ding, Linlin Song, Qunhui Yuan, Weiwei Zhao, Cheng‐Yan Xu, Jun Wei, Mingyu Li, Hongjun Ji
Topics & Concepts
Materials scienceSinteringConductivityContact resistanceComposite materialFlexible electronicsNanoparticleNanotechnologyBioelectronicsElectrical conductorElectrical resistivity and conductivityBend radiusOxideMetallurgyBendingElectrical engineeringEngineeringLayer (electronics)BiosensorChemistryPhysical chemistryNanomaterials and Printing TechnologiesAdvanced Sensor and Energy Harvesting MaterialsOrganic Electronics and Photovoltaics