Experimental and multiphysics simulation study of atoms migration and morphology evolution in solder joints under high current density
Fei Jia, Leyi Niu, Yuchen Xi, Yuanying Qiu, Hongbo Ma, Chengpeng Yang
Topics & Concepts
Materials scienceMultiphysicsElectromigrationSolderingCathodeCurrent crowdingComposite materialAnodeCurrent densityHeat transferMicrostructureDiffusionVoid (composites)MechanicsFinite element methodThermodynamicsPhysical chemistryChemistryPhysicsElectrodeQuantum mechanicsElectronic Packaging and Soldering TechnologiesCopper Interconnects and ReliabilityInjection Molding Process and Properties