Effect of thermal expansion on thermal contact resistance prediction based on the dual-iterative thermal–mechanical coupling method
Yanjun Dai, Xing-Jie Ren, Yungang Wang, Qi Xiao, Wen‐Quan Tao
Topics & Concepts
Materials scienceRotational symmetryThermal contactThermal contact conductanceHeat transferThermalThermal expansionCoupling (piping)Iterative methodMechanicsThermal resistanceComposite materialThermodynamicsPhysicsComputer scienceAlgorithmAdhesion, Friction, and Surface InteractionsBrake Systems and Friction AnalysisTribology and Wear Analysis