Structural optimization of thermal stresses in BGA solder joints based on improved BP neural network-genetic algorithm
Haoyu Wang, Jianshe Ma, Mali Gong, Ping Su
Topics & Concepts
Ball grid arraySolderingArtificial neural networkGenetic algorithmMaterials scienceThermalComputer scienceStress (linguistics)Finite element methodStructural engineeringMechanical engineeringAlgorithmComposite materialEngineeringArtificial intelligenceMachine learningPhilosophyMeteorologyPhysicsLinguisticsElectronic Packaging and Soldering Technologies3D IC and TSV technologiesInjection Molding Process and Properties