Transient temperature distribution in a multilayer semiconductor device with dynamic thermal load and non-uniform thermal contact resistance between layers
Girish Krishnan, Ankur Jain
Topics & Concepts
MicroelectronicsLaplace transformMaterials scienceThermal resistanceThermalThermal contact conductanceThermal contactWork (physics)Transient (computer programming)Contact resistanceChipMechanicsSemiconductorMechanical engineeringHeat transferLayer (electronics)Computer scienceComposite materialThermodynamicsOptoelectronicsPhysicsMathematicsMathematical analysisEngineeringTelecommunicationsOperating systemThermal properties of materialsElectronic Packaging and Soldering Technologies3D IC and TSV technologies