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Highly conductive thermal interface materials with vertically aligned graphite-nanoplatelet filler towards: High power density electronic device cooling

Xulei Wu, Huatao Wang, Ziao Wang, Jinglong Xu, Yajin Wu, Rui Xue, Hongxin Cui, Cong Tian, Yu Wang, Xiaoxiao Huang, Bo Zhong

2021Carbon63 citationsDOI

Topics & Concepts

Materials scienceThermal conductivityGraphiteThermal greasePower densityElectronicsComposite materialElectrical conductorThermal management of electronic devices and systemsThermalOptoelectronicsMechanical engineeringElectrical engineeringPower (physics)MeteorologyEngineeringPhysicsQuantum mechanicsThermal properties of materialsThermal Radiation and Cooling TechnologiesAdvanced Thermoelectric Materials and Devices
Highly conductive thermal interface materials with vertically aligned graphite-nanoplatelet filler towards: High power density electronic device cooling | Litcius