Ultrasonic-Assisted Dispersion of ZnO Nanoparticles to Sn-Bi Solder: A Study on Microstructure, Spreading, and Mechanical Properties
Sri Harini Rajendran, Hyejun Kang, Jae Pil Jung
Topics & Concepts
Materials scienceMicrostructureEutectic systemNanocompositeSolderingUltimate tensile strengthComposite materialSolder pasteNanoparticleDuctility (Earth science)CastingDispersion (optics)AlloyLamellar structureMetallurgyNanotechnologyCreepPhysicsOpticsElectronic Packaging and Soldering TechnologiesNanomaterials and Printing TechnologiesAluminum Alloys Composites Properties