Reliability of Ag Sinter-Joining Die Attach Under Harsh Thermal Cycling and Power Cycling Tests
Zheng Zhang, Chuantong Chen, Aiji Suetake, Ming-Chun Hsieh, Katsuaki Suganuma
Topics & Concepts
Materials scienceTemperature cyclingDie (integrated circuit)Power cyclingJunction temperatureComposite materialSolderingShear strength (soil)Thermal resistancePower moduleDirect shear testPower electronicsRibbonMetallurgyReliability (semiconductor)VoltageThermalShear (geology)Electrical engineeringPower (physics)NanotechnologyMeteorologySoil waterPhysicsQuantum mechanicsEngineeringSoil scienceEnvironmental scienceElectronic Packaging and Soldering Technologies3D IC and TSV technologiesSilicon Carbide Semiconductor Technologies