Litcius/Paper detail

Growth Rate of Intermetallics in Aluminum to Copper Dissimilar Welding

Muralimohan Cheepu, P. Susila

2020Transactions of the Indian Institute of Metals32 citationsDOI

Topics & Concepts

IntermetallicMaterials scienceWeldingMetallurgyCopperUltimate tensile strengthAluminiumScanning electron microscopeComposite materialAlloyAdvanced Welding Techniques AnalysisIntermetallics and Advanced Alloy PropertiesElectronic Packaging and Soldering Technologies