A review on numerical approach of reflow soldering process for copper pillar technology
Jing Rou Lee, Mohd Sharizal Abdul Aziz, M. H. H. Ishak, C. Y. Khor
Topics & Concepts
Reflow solderingFlip chipSolderingInterconnectionPrinted circuit boardThermal copper pillar bumpBall grid arrayMechanical engineeringBall (mathematics)EngineeringMaterials scienceElectrical engineeringLayer (electronics)AdhesiveMetallurgyComposite materialTelecommunicationsMathematicsMathematical analysisElectronic Packaging and Soldering Technologies3D IC and TSV technologiesVibration and Dynamic Analysis