Impact of Ni-coated carbon fiber on the interfacial (Cu,Ni)6Sn5 growth of Sn-3.5Ag composite solder on Cu substrate during reflow and isothermal aging
Yihui Du, Yishu Wang, Xiaoliang Ji, Qiang Jia, Fuwen Zhang, Fu Guo
Topics & Concepts
Materials scienceSolderingIntermetallicComposite numberIsothermal processSubstrate (aquarium)Composite materialLayer (electronics)WettingAlloyMetallurgyOceanographyGeologyPhysicsThermodynamicsElectronic Packaging and Soldering Technologies3D IC and TSV technologiesAdvanced Welding Techniques Analysis