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Growth behavior of intermetallic layers at the interface between Cu and eutectic Sn–Bi by grain boundary diffusion with the grain growth at solid-state temperatures

O Minho, Yūki Tanaka, Equo Kobayashi

2023Intermetallics17 citationsDOI

Topics & Concepts

IntermetallicMaterials scienceEutectic systemAnnealing (glass)Grain boundary diffusion coefficientGrain growthGrain boundaryThermodynamicsIsothermal processMicrostructureMetallurgyAlloyPhysicsElectronic Packaging and Soldering TechnologiesAluminum Alloy Microstructure PropertiesIntermetallics and Advanced Alloy Properties
Growth behavior of intermetallic layers at the interface between Cu and eutectic Sn–Bi by grain boundary diffusion with the grain growth at solid-state temperatures | Litcius