Litcius/Paper detail

Heat transfer in a multi-layered semiconductor device with spatially-varying thermal contact resistance between layers

Girish Krishnan, Ankur Jain

2022International Communications in Heat and Mass Transfer20 citationsDOI

Topics & Concepts

Thermal contactThermal contact conductanceThermal resistanceMicroelectronicsMaterials scienceHeat transferThermalContact resistanceWork (physics)Heat fluxSemiconductorMechanicsInterfacial thermal resistanceLayer (electronics)ThermodynamicsPhysicsComposite materialNanotechnologyOptoelectronicsAdhesion, Friction, and Surface InteractionsThermal properties of materials3D IC and TSV technologies