Investigating the impacts of heat sink design parameters on heat dissipation performance of semiconductor packages
Rilwan Kayode Apalowo, Aizat Abas, Muhammad Razin Salim, Mohamad Fikri Mohd Sharif, Chia Siang Kok
Topics & Concepts
Heat sinkDissipationThermal management of electronic devices and systemsMaterials scienceSemiconductorSink (geography)Environmental scienceMechanicsNuclear engineeringThermodynamicsMechanical engineeringOptoelectronicsPhysicsGeographyEngineeringCartographyHeat Transfer and OptimizationElectronic Packaging and Soldering TechnologiesAdhesion, Friction, and Surface Interactions