Electroplasticity of Metals and Ceramics: Current Status
Apurv Dash, Yuchen Liu, Hidehiro Yoshida, Robert Mücke, Gregory Gerstein, Sebastian Herbst, Florian Nürnberger, Hans Jürgen Maier, Heung Nam Han, Shih‐kang Lin, Olivier Guillon
Abstract
This review covers the anelastic deformation observed under electric loading (electroplasticity) of metals and ceramics. The interplay of various complex mechanisms beyond trivial Joule heating leading to enhanced plasticity is discussed in the context of both materials classes. In the case of metals, electromechanical coupling resulting in forces being exerted on atoms and dislocations is elucidated. In the case of ceramics, change in the grain boundary structure is proposed to justify the enhanced plasticity. Microstructural evidence is analyzed in correlation with the deformation behavior.